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IC Substrate

CSP、FC-CSP、SIP、MCP、PBGA、FMC Ultra thin core substrate (ChipLED, SD Card, UDP, MEMS), BT Material

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Rigid-Flex PCB & FPC

Maximum 6L Flex Between, rigid part can be built by HDI, Hybrid Lamination (Blind & Buried Via, Unclad, Airgap)

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HDI(Blind and Buried Via)

Up to 16L ELIC (Any layer), 45um/45um line, Skip via, Stagger via, Stacked Via, POFV, Copper Fill, Resin Plug, VIPPO

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Conventional PCB

1-40Layers, Electroplating Gold/Nichel/Silver & ENEPIG. Back drill, Ultra thin PCB, Heavy copper.

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About GOLDENPCB

  • Goldenpcb group is a high-tech PCB R&D and manufacturing company established in 2005. We specialize in substrates used in semiconductor packaging, as well as high-end complex PCBs, including traditional PCBs, HDI, FPC and Rigid-flex. The group currently has three independent factories, each of which plays a different function and provides our customers with a variety of PCB solutions.

  • Plant 1: Huizhou Dayawan       |       Establish: 2011       |      Employee: 250
    Production Type: Substrate & Rigid PCB       |       Capacity: 10K Sqm/Month
    Application: Substrate(LED Display, MEMS, Sensor), Rigid PCB(Medical, Automotive, Mini & Micro LED)
    Sales revenue: 35 Million USD in 2021       |       35/35um Circuit, 0.1mm Total Thickness

  • Plant 2: Jiangmen Xinhui       |       Establish: 2020       |      Employee: 300 in 2023*
    Production Type: BGA, CSP, LGA Substrate, HDI,FC      |       Capacity: 20K Sqm/Month in 2023*
    Application: Memory, Sensor, PA, Filter, SIP
    Sales revenue: 60 Million USD in 2023*       |       15/15um Circuit, MSAP, ETS, SAP, Coreless

  • Plant 1: Huizhou Shumayuan       |       Establish: 2021(Acquired)       |      Employee: 150
    Production Type: Rigid-Flex & FPC       |       Capacity: 20K Sqm/Month
    Application: TWS, Side Press, Connector, LCD, Camera
    Sales revenue: 18 Million USD in 2021       |       HDI Rigid-flex, Multilayer FPC

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