Item |
Capability |
|---|---|
Layers |
1-4Layers |
Technology Type |
CSP、FC-CSP、SIP、MCP、PBGA、FMC、MEMS |
Material Type |
BT(Bismaleimide Triazine) |
Material Brand |
|
Finished Thickness |
0.1mm - 2L / 0.2mm - 4L |
Surface Finishing |
ENEPIG, Electro Ni/Au, Electro Ni/Ag/Au, Electro Ni/Ag, Electro Tin |
Line Width/Spacing |
35/35um |
Drill/Pad |
75/175 um - Mechanical, 60/130 um - Laser |
Special Technique |
POFV(VIPPO), Plane Hybrid, Partial Hybrid, Step/Section Gold Finger, Cavity, Back-drilling, Edge Plating,
Special Feature
POFV(VIPPO), Plane Hybrid, Partial Hybrid, Step/Section Gold Finger, Cavity, Back drilling, Edge Plating,
Embedded Chip/Discrete Device, Embedded Plane Capacitor/Resistor, N+N Structure(Belly-Belly),
Mechanical Blind Hole with Double-side Press-fit, Partial Heavy Copper, High Temp. Lamination without
Prepreg, Copper/Silver Filled, Skip via |