Item |
Capability |
|---|---|
Layers |
1-42Layers, 6+N+6 HDI |
Technology Type |
Heavy Copper, Backplane, Backdrill, Blind Via, Buried Via, VIP(Via In PAD), VOP(Via On Pad), Copper Paste, Silver Paste, Copper Fill, Hybrid laminating, Embedded Capacitance, Embedded resistance |
Material Type |
FR4 (High TG , Halogen Free , High CTI) , PTFE, BT(Bismaleimide Triazine), Ceramic Partical |
Material Brand |
Shengyi(S1141, S1000, S1000-2), ITEQ(IT150,IT180A), ISOLA(370HR, FR408,FR406), Rogers(R4003, R4350), EMC(EM827), Nanya(NP175,NP180), Ventec(VT-47), Panasonic(Megtron4,Megtron6,Megtron7),Taconic, Arlon, Nelco |
Finished Thickness |
0.1mm - 6.0mm |
Board Size |
545X1500mm / 21.5inchX59inch |
Copper Thickness |
1/3OZ - 10OZ |
Surface Finishing |
Flash gold(electroplated gold), ENIG, Hard gold, Flash gold,HASL Lead free,OSP, ENEPIG, Soft gold, Immersion silver,Immersion Tin, ENIG+OSP,ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger |
Line Width/Spacing |
45/45um |
Via and Hole Size |
0.10-6.2mm（Machanical） 0.075-0.15mm（Laser） |
Min BGA pad size |
6mil (0.15mm) for ENIG、Immersion Tin、Immersion Sliver、OSP |
Special Technique |
POFV(VIPPO), Plane Hybrid, Partial Hybrid, Step/Section Gold Finger, Cavity, Back-drilling, Edge Plating,
Special Feature
POFV(VIPPO), Plane Hybrid, Partial Hybrid, Step/Section Gold Finger, Cavity, Back drilling, Edge Plating,
Embedded Chip/Discrete Device, Embedded Plane Capacitor/Resistor, N+N Structure(Belly-Belly),
Mechanical Blind Hole with Double-side Press-fit, Partial Heavy Copper, High Temp. Lamination without
Prepreg, Copper/Silver Filled, Skip via |