Item |
Capability |
|---|---|
Layers |
1-8 Layers Flex, 2-20 Rigid Flex |
Technology Type |
Heavy Copper, Backplane, Backdrill, Blind Via, Buried Via, VIP(Via In PAD), VOP(Via On Pad), Copper Paste, Silver Paste, Copper Fill, Hybrid laminating, Embedded Capacitance, Embedded resistance |
Material Type |
FR4 (High TG , Halogen Free , High CTI) , PTFE, BT(Bismaleimide Triazine), Ceramic Partical |
Material Brand |
Shengyi(S1141, S1000, S1000-2), ITEQ(IT150,IT180A), ISOLA(370HR, FR408,FR406), Rogers(R4003, R4350), EMC(EM827), Nanya(NP175,NP180), Ventec(VT-47), Panasonic(Megtron4,Megtron6,Megtron7),Taconic, Arlon, Nelco |
Finished Thickness |
0.1mm - 0.8 mm (Flex Without Stiffener) / 0.2-4.0mm (Rigid-flex) |
Board Size |
220mm X 400mm(Flex) / 400mm*550mm(Rigid-Flex) |
Copper Thickness |
1/3OZ - 3OZ |
Surface Finishing |
HASL ,ENIG, ENEPIG, Electrolytic Nickel Gold, Soft gold,Hard gold, Immersion silver and OSP |
Line Width/Spacing |
45/45um |
Via and Hole Size |
0.10-6.2mm（Machanical） 0.075-0.15mm（Laser） |