16L Network Control Module

Layer Count : 16L

Board Thickness : 2.4mm

Material : FR4 TG170

Copper Thickness : 1/1/......../1/1 OZ

Copper in the hole barrel: 25um

Min Line Width/Spacing : 0.075/0.075mm

Min Via Diameter : 0.2mm

Aspect Ratio : 12:1

Min BGA : 0.25mm

Surface Finishing : ENIG 2-3U"

Application : Server