26L Server Module

Layer Count : 26L

Board Thickness : 3.0mm

Material : FR4 TG170 Low Loss Low DK

Copper Thickness : 1/1/......./1/1 OZ

Copper in the hole barrel: 25um

Min Line Width/Spacing : 0.075/0.075mm

Min Via Diameter : 0.2mm

Aspect Ratio : 15:1

Min BGA : 0.2mm

Surface Finishing : ENIG 2-3U"

Application : Network Server