2 Layers Mini LED Backlight COB / wire bonding PCB

Layer Count : 2L

Board Thickness : 0.3 +/- 0.03mm

Material : FR4

Copper Thickness : 1/1 OZ

Min Line Width/Spacing : 0.075/0.075mm

Min Via Diameter : 0.2mm

Surface Finishing : ENEPIG

Technology : 8 Mil Pad over whole surface

Application : Digital Product Backlight Module Packaging