2 Layers SD Card Substrate

Layer Count : 2L

Board Thickness : 0.2 +/- 0.03mm

Material : BT/Bismaleimide Triazine

Copper Thickness : 18um

Min Line Width/Spacing : 0.05/0.05mm

Min Via Diameter : 0.2mm Mechanical Drill

Surface Finishing : Electro Plating Gold

Technology : Super Thin

Application : Memory SD Card Packaging