4 Layers Camera Module Substrate

Layer Count : 4L

Board Thickness : 0.3 +/- 0.05mm

Material : FR4 TG170

Copper Thickness : 25um

Min Line Width/Spacing : 0.09/0.05mm

Min Via Diameter : 0.15mm

Surface Finishing : ENEPIG

Technology : Wire Bonding

Technology : Resin Plug

Application : Camera Module Packaging