4L Wifi Module PCB

Layer Count : 4L

Board Thickness : 0.8mm

Material : FR4

Copper Thickness : 1/1/1/1 OZ

Copper in the hole barrel: 20um

Min Line Width/Spacing : 0.075/0.075mm

Min Via Diameter : 0.2mm

Aspect Ratio : 8:1

Min BGA : 0.25mm

Surface Finishing : ENIG 2-3U"

Application : WIFI Module