10L Mobilephone HDI PCB

Layer Count : 10L

Board Thickness : 0.8mm

Material : NP155F

Copper Thickness : 1/1....1/1 OZ

Copper in the hole barrel: 20um

Min Line Width/Spacing : 0.05/0.05mm

Min Via Diameter : 0.075mm Blind Via

Surface Finishing : Selective Immersion Gold

Extra Treatment : POFV

Technology : 3Layers stack vias 1-2,2-3,3-4,1-4

Application : Smart Terminal