4 Layers HDI CellPhone PCB

Layer Count : 4L

Board Thickness : 0.8 mm

Material : NP155F

Copper Thickness : 1/1/1/1 OZ

Copper in the hole barrel: 18um

Min Line Width/Spacing : 0.071/0.071mm

Min Via Diameter : 0.1mm Blind Via

Surface Finishing : OSP + ENIG

Extra Treatment : POFV

Technology : L1-2，L1-4，L3-4

Application : Mobile Phone