4L HDI Earphone PCB With Blind & Buried Via

Layer Count : 4L

Board Thickness : 0.6mm

Material : NP155F

Copper Thickness : 1/1/1/1 OZ

Copper in the hole barrel: 18um

Min Line Width/Spacing : 0.065/0.065mm

Min Via Diameter : 0.1mm Blind Via

Surface Finishing : Immersion Gold

Extra Treatment : POFV

Technology : Via to Circuit 4.5mil/0.115mm

Application : Audio/Earphone/Headphone