2 Layers LGA Chip Substrate

Layer Count : 2L

Board Thickness : 0.36 +/- 0.03mm

Material : BT HL832HF

Copper Thickness : 25um

Min Line Width/Spacing : 0.04/0.04mm

Min Via Diameter : 0.1mm

Surface Finishing : Soft Gold

Technology : Wire Bonding

Application : LGA Chip Packaging