2 Layers UDP Substrate

Layer Count : 2L

Board Thickness : 0.3 +/- 0.03mm

Material : AMC832HF

Copper Thickness : 25um

Min Line Width/Spacing : 0.1/0.05mm

Min Via Diameter : 0.15mm

Surface Finishing : Soft Gold

Technology : Wire Bonding

Application : USB Disk In Packaging