2 Layers Micro SD Substrate

Layer Count : 2L

Board Thickness : 0.19 +/- 0.03mm

Material : AMC832HF

Copper Thickness : 18um

Min Line Width/Spacing : 0.05/0.05mm

Min Via Diameter : 0.15mm

Surface Finishing : Soft Gold + Hard Gold

Technology : Wire Bonding

Application : Micro SD