Item |
Capability |
|---|---|
Layers |
1-4 Layers, Metal Core (sandwich) or Metal Base |
Technology Type |
IMS, Thermoelectric separation, Mirror Reflection, Bendable, Blind Via, Depth Control Slot (Blind Slot), Cup hole, COB, Circuitry & Copper Base Connected |
Material Type |
Aluminum, Copper, Ferrum, Ceramic, stainless steel |
Material Brand |
Bergquist, EMC, Polytronics , Shengyi , East Power , Ventec, Laird |
Finished Thickness |
0.4mm - 3.2mm |
Board Size |
545X1500mm / 21.5inchX59inch |
Copper Thickness |
1/3OZ - 10OZ |
Surface Finishing |
Flash gold(electroplated gold), ENIG, Hard gold, Flash gold,HASL Lead free,OSP, ENEPIG, Soft gold, Immersion silver,Immersion Tin, ENIG+OSP,ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger |
Thermal conductivity |
1-10W/mK |
Via and Hole Size |
0.2-6.2mm（Machanical） 0.075-0.15mm（Laser） |