Hybrid Neclo N9000 PCB

Layer Count : 8L

Board Thickness : 1.2mm

Material : Nelco N9000 Ceramic Filler

Copper Thickness : 1/1....1/1 OZ

Copper in the hole barrel: 20um

Min Line Width/Spacing : 0.1/0.1mm

Min Via Diameter : 0.2mm

Surface Finishing : Immersion Gold

Extra Treatment : Resin Via Plug/PFOV

Extra Treatment : Multiple Impedance control

Extra Treatment : FR4 + Nelco N9000 Hybrid Lamination

Application : Radio Frequency Device