8 Layers HDI Smart Cellphone PCB

Layer Count : 8L

Board Thickness : 0.8 mm

Material : NP155F

Copper Thickness : 1/1....1/1 OZ

Copper in the hole barrel: 18um

Min Line Width/Spacing : 0.05/0.05mm

Min Via Diameter : 0.1mm Blind Via

Surface Finishing : OSP + ENIG

Extra Treatment : POFV

Technology : 2Layers stack vias 1-2,2-3,1-3

Application : Smart Phone