6 Layers CellPhone mother Board

Layer Count : 6L

Board Thickness : 0.8 mm

Material : NP155F

Copper Thickness : 1/1/1/1/1/1 OZ

Copper in the hole barrel: 18um

Min Line Width/Spacing : 0.075/0.075mm

Min Via Diameter : 0.1mm Blind Via

Surface Finishing : OSP + ENIG

Extra Treatment : POFV

Technology : L1-2，L1-8，L7-8

Application : Smart Phone